# | Title | Type | Language | |||||||||||
1. | MK71050-03 Evaluation Kit Hardware Manual ROHM GROUP FEXK71050 03 USB EK HardManual 01 LAPIS SEMICONDUCTOR MK71050 03 Evaluation Kit MK71050 03USB EK Hardware Manual Initial Release Official June 11 2015 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual Precautions for the Specification 1 Contents of the Specification are the information at the time of their issuance The information contained herein is subject to change without notice 2 LAPIS Semiconductor has used reasonabl |
PDF Manual | ENGLISH | |||||||||||
# | Title | Type | Language | Download | ||||||||||
1. | MK71050-03 Bluetooth Low Energy Wireless Module ROHM GROUP LAPIS SEMICONDUCTOR FEDK71050 03 01 MK71050 03 Bluetooth Low Energy wireless module Overview MK71050 03 is a Bluetooth Low Energy here in after LE wireless module which is integrating ML7105C 001 Bluetooth LE SoC E2PROM 26 2 crystal oscillator 2 4GHz PCB pattern antenna and passive components It has Bluetooth LE compliant 2 4GHz band radio communication capability MK71050 03 is suitable for applications such as Healthcare device Remote C |
PDF Manual | ENGLISH | |||||||||||
2. | MK71050 Evaluation Kit Hardware Manual ROHM GROUP PEXK71050 03 EvalKit HardManual 02 LAPIS SEMICONDUCTOR MK 71050 03 Evaluation Kit Hardware Manual Issue Date Mar 10 2015 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual Notes Precautions for the Specification 1 Contents of the Specification are the information at the time of their issuance The information contained herein is subject to change without notice 2 LAPIS Semiconductor has used reasonable care in prepa |
PDF Manual | ENGLISH | |||||||||||
3. | MK71050-03 Evaluation Kit Hardware Manual ROHM GROUP FEXK71050 03 USB EK HardManual 01 LAPIS SEMICONDUCTOR MK71050 03 Evaluation Kit MK71050 03USB EK Hardware Manual Initial Release Official June 11 2015 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual Precautions for the Specification 1 Contents of the Specification are the information at the time of their issuance The information contained herein is subject to change without notice 2 LAPIS Semiconductor has used reasonabl |
PDF Manual | ENGLISH |
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